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US 2022/0093518 A1Published application
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsCheng Kai Chang, Chang-Fu Lin, Don-Son Jiang
Life of this patent
Estimating the term…
Abstract
An electronic package is provided, which is disposed with a second electronic component and a third electronic component on a first electronic component as a carrier structure, such that there is no need to match a layout size of the conventional package substrate. Therefore, the first electronic component can be designed as a System on a Chip (SoC) with a smaller size to improve the process yield.
Claims20
An electronic package, comprising:
- a first electronic component having an active face and electrode pads disposed on the active face;
- a second electronic component provided on the active face of the first electronic component and having a first side and a second side opposite to each other and a plurality of conductive vias interconnecting the first side and the second side, wherein the second electronic component is connected to the active face via the first side, and the plurality of conductive vias are electrically connected with the electrode pads;
- and
- a third electronic component provided on the active face of the first electronic component and electrically connected to the electrode pads.
1 more element
A method of manufacturing an electronic package, comprising:
- providing a first electronic component having an active face and electrode pads disposed on the active face;
- providing a second electronic component on the active face of the first electronic component, wherein the second electronic component has a first side and a second side opposite to each other and a plurality of conductive vias interconnecting the first side and the second side, such that the second electronic component is connected to the active face via the first side, and the plurality of conductive vias are electrically connected with the electrode pads;
- and
- providing a third electronic component on the active face of the first electronic component and electrically connected to the electrode pads.
1 more element
Dependencies are inferred from the claim text.