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US 2022/0093517 A1Published application
Direct bonding in microelectronic assemblies
AssigneeIntel Corporation
InventorsAleksandar Aleksov, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Feras Eid, Randy B. Osborne, Van H. Le
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Abstract
Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include an interposer, including an organic dielectric material, and a microelectronic component coupled to the interposer by direct bonding.
Claims20
A microelectronic assembly, comprising:
- an interposer including an organic dielectric material;
- and
- a microelectronic component coupled to the interposer by a direct bonding region.
Dependencies are inferred from the claim text.