Deposition of graphene on a dielectric surface for next generation interconnects

An integrated circuit structure, comprising:

• a conductive metal structure;
• a graphene barrier material completely laterally surrounding the conductive metal structure, wherein the conductive metal is in direct contact with the graphene barrier material;
• and
• a dielectric material completely laterally surrounding the graphene barrier material.

A computing device, comprising:

• a board;
• and
• a component coupled to the board, the component including an integrated circuit structure, comprising:
• a dielectric material having an opening therein, the opening having sides;
• a graphene barrier material conformal to the sides of the opening;
• and
• a conductive metal adjacent to the graphene barrier material and filling a remainder of the opening in the dielectric material, the conductive metal in direct contact with the graphene barrier material.

A computing device, comprising:

• a board;
• and
• a component coupled to the board, the component including an integrated circuit structure, the integrated circuit structure comprising:
• conductive metal structure;
• graphene barrier material completely laterally surrounding the conductive metal structure, wherein the conductive metal is in direct contact with the graphene barrier material;
• and
• a dielectric material completely laterally surrounding the graphene barrier material.