Integrated structure with bifunctional routing and assembly comprising such a structure
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsCandice THOMAS, Jean CHARBONNIER, Perceval COUDRAIN, Maud VINET
Life of this patent
Estimating the term…
Abstract
An integrated structure intended to connect a plurality of semiconductor devices, the integrated structure including a substrate, a first face and a second face, the first face being intended to receive the semiconductor devices, the integrated structure including, at the first face, at least one routing level, the routing level or levels including: at least one first conductor routing track in a conductor material; and at least one first superconductor routing track made from a superconductor material.
Claims14
An integrated structure intended to connect a plurality of semiconductor devices, the integrated structure comprising a substrate, a first face and a second face, the first face being intended to receive the semiconductor devices, the integrated structure comprising, at the first surface, at least one routing level, the at least one routing level comprising:
- at least one first conductor routing track made from a non-superconductor conductor material;
- and
- at least one first superconductor routing track made from a superconductor material.
Dependencies are inferred from the claim text.