Hybrid Dielectric Scheme in Packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Hsun Chen, Jiun Yi Wu, Chen-Hua Yu
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Abstract
A method includes forming a first redistribution line, forming a polymer layer including a first portion encircling the first redistribution line and a second portion overlapping the first redistribution line, forming a pair of differential transmission lines over and contacting the polymer layer, and molding the pair of differential transmission lines in a molding compound. The molding compound includes a first portion encircling the pair of differential transmission lines, and a second portion overlapping the pair of differential transmission lines. An electrical connector is formed over and electrically coupling to the pair of differential transmission lines.
Claims20
A package comprising:
- a plurality of polymer layers, wherein the plurality of polymer layers have first thicknesses;
- a plurality of molding compound layers, wherein the plurality of polymer layers and the plurality of molding compound layers are positioned alternatingly, and wherein the plurality of molding compound layers have second thicknesses greater than the first thicknesses;
- a first redistribution line in each of the plurality of polymer layers;
- and
- a second redistribution line in each of the plurality of molding compound layers.
A package comprising:
- a plurality of polymer layers;
- a plurality of molding compound layers, wherein the plurality of polymer layers and the plurality of molding compound layers are positioned alternatingly, and each of the plurality of molding compound layers physically contacts an overlying one and an underlying one of the plurality of polymer layers;
- a first plurality of vias, each in one of the plurality of polymer layers;
- and
- a second plurality of vias, each in one of the plurality of molding compound layers, wherein the first plurality of vias and the second plurality of vias are electrically interconnected.
A package comprising:
- a first plurality of dielectric layers, wherein each of the first plurality of dielectric layers is formed of a homogeneous dielectric material;
- a second plurality of dielectric layers, wherein each of the second plurality of dielectric layers comprises:
- a base material;
- and
- filler particles in the base material;
- a first plurality of conductive features, each penetrating through one of the first plurality of dielectric layers;
- a second plurality of conductive features, each penetrating through one of the second plurality of dielectric layers;
- and
- an electrical connector electrically connected to the first plurality of conductive features and the second plurality of conductive features.
Dependencies are inferred from the claim text.