Lead frame
AssigneeChang Wah Technology Co., Ltd.
InventorChia-Neng HUANG
Life of this patent
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Abstract
A lead frame is made of conductive material, and includes an interconnecting web portion and a plurality of unit lead frames. Each unit lead frame includes a die pad and a plurality of leads. The die pad has a die-attach section disposed below an upper surface of the interconnecting web portion, and a plurality of extension sections bent at an angle from a periphery of the die-attach section and projecting to the interconnecting web portion. The die pad is formed with a plurality of grooves formed at an underside of junctions of the die-attach section and the extension sections. The leads extend from the interconnecting web portion toward and are spaced apart from the die pad.
Claims11
A lead frame made of conductive material and comprising:
- an interconnecting web portion that is in a crisscross pattern;
- and
- a plurality of unit lead frames, said interconnecting web portion being configured complementarily to said unit lead frames, each of said unit lead frames including
- a die pad that has a die-attach section being disposed below an upper surface of said interconnecting web portion, and a plurality of extension sections bent at an angle from a periphery of said die-attach section and projecting upward to said interconnecting web portion, said die pad being formed with a plurality of grooves that are formed at an underside of junctions of said die-attach section and said extension sections, each groove having a portion that is formed in said die-attach section and another portion that is formed in a respective one of said extension sections, and
- a plurality of leads extending from said interconnecting web portion toward and spaced from said die pad.
Dependencies are inferred from the claim text.