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US 2022/0093487 A1Published application
Integrated circuit direct cooling systems and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsSeungwon IM, Oseob JEON, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE, Changyoung PARK
Life of this patent
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Abstract
Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.
Claims20
A semiconductor package comprising:
- a first cover coupled to a first substrate, the first substrate coupled to a first die;
- a first cooling system positioned between an inner face of the first substrate and an outer face of the first cover;
- a second cover coupled to a second substrate, the second substrate coupled to a second die;
- a second cooling system positioned between an inner face of the second substrate and an outer face of the second cover;
- and
- a spacer coupled between the first die and the second die;
- wherein the first cooling system and the second cooling system each comprise a flow control device configured to induce turbulent flow of a cooling medium passing through the first cooling system and the second cooling system.
4 more elements
A semiconductor package comprising:
- a first cover coupled to a first substrate, the first substrate coupled to a first die;
- a first cooling system positioned between an inner face of the first substrate and an outer face of the first cover;
- a second cover coupled to a second substrate, the second substrate coupled to a second die;
- a second cooling system positioned between an inner face of the second substrate and an outer face of the second cover;
- and
- a spacer coupled between the first die and the second die;
- wherein the first cooling system and the second cooling system each comprise a heat slug with fins.
4 more elements
A semiconductor package comprising:
- a first cover coupled to a first substrate, the first substrate coupled to a first die;
- a first cooling system comprised within the first substrate;
- a second cover coupled to a second substrate, the second substrate coupled to a second die;
- a second cooling system comprised within the second substrate;
- and
- a spacer coupled between the first die and the second die;
- wherein the first cooling system and the second cooling system each comprise a flow control device configured to induce turbulent flow of a cooling medium passing through the first cooling system and the second cooling system.
4 more elements
Dependencies are inferred from the claim text.