Power semiconductor module with clamping device
AssigneeInfineon Technologies AG
InventorsTomas Manuel Reiter, Elvis Keli, Anthony Thomas
Life of this patent
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Abstract
A power semiconductor module includes: a carrier; a plurality of semiconductor dies attached to a first side of the carrier and electrically connected to form a circuit or part of a circuit; a cooling device at a second side of the carrier opposite the first side; a clamping device attached to the cooling device and pressing the carrier toward the cooling device such that the second side of the carrier is in thermal contact with the cooling device without having an intervening base plate between the carrier and the cooling device; and a first sensor device embedded in the clamping device or attached to an interior surface of the clamping device.
Claims20
A power semiconductor module, comprising:
- a carrier;
- a plurality of semiconductor dies attached to a first side of the carrier and electrically connected to form a circuit or part of a circuit;
- a cooling device at a second side of the carrier opposite the first side;
- a clamping device attached to the cooling device and pressing the carrier toward the cooling device such that the second side of the carrier is in thermal contact with the cooling device without having an intervening base plate between the carrier and the cooling device;
- and
- a first sensor device embedded in the clamping device or attached to an interior surface of the clamping device.
A power semiconductor module, comprising:
- a carrier;
- a plurality of semiconductor dies attached to a first side of the carrier and electrically connected to form a circuit or part of a circuit;
- a cooling device at a second side of the carrier opposite the first side;
- a clamping device attached to the cooling device and pressing the carrier toward the cooling device such that the second side of the carrier is in thermal contact with the cooling device without having an intervening base plate between the carrier and the cooling device, the clamping device comprising a cover member and a plurality of pressing members extending from the cover member in a direction toward the carrier, each one of the pressing members pressing against one of the semiconductor dies, a metal clip attached to one of the semiconductor dies, or the first side of the carrier;
- signal pins confined within the power semiconductor module between the carrier and the cover member of the clamping device, the signal pins configured to provide signal connections to the semiconductor dies;
- and
- a signal routing structure embedded in or attached to the cover member of the clamping device,
- wherein the signal pins connect to and terminate at the signal routing structure,
- wherein the signal routing structure is configured to route the signal connections to a connector that is accessible at a side of the cover member facing away from the carrier.
Dependencies are inferred from the claim text.