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US 2022/0093485 A1Published application
Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsTatsuya Kobayashi, Fumiyoshi Kawashiro, Hisashi Tomita
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Abstract
According to one embodiment, a semiconductor device includes a semiconductor chip having a first electrode on a first surface, a metal plate, and a first conductive bonding sheet that is disposed between the first surface of the semiconductor chip and the metal plate and bonds the first electrode to the metal plate.
Claims7
A semiconductor device comprising:
- a semiconductor chip having a first electrode on a first surface of the semiconductor chip,
- a metal plate, and
- a first conductive bonding sheet disposed between the first surface of the semiconductor chip and the metal plate, and configured to bond the first electrode to the metal plate.
Dependencies are inferred from the claim text.