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US 2022/0093482 A1Published application
Semiconductor package with dams
AssigneeUTAC Headquarters Pte. Ltd.
InventorsJeffrey Punzalan, IL KWON SHIM
Life of this patent
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Abstract
A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The package includes a dam structure configured to protect components of the semiconductor package from contamination.
Claims20
A device comprising:
- a package substrate having top and bottom major package substrate surfaces, the top major package surface includes a die attach region;
- a die having a second major die surface attached to the die attach region, wherein a first major die surface of the die includes a sensor region and a die adhesive region surrounding the sensor region;
- a cover adhesive disposed on the die adhesive region;
- a protective cover attached to the die by the cover adhesive, the protective cover forms a cavity over the sensor region;
- and
- a dam structure, the dam structure protects components of the device by preventing contaminants from bleeding beyond the dam structure.
3 more elements
A method for forming a semiconductor package comprising:
- providing a package substrate having top and bottom major package substrate surfaces, the top major package surface includes a die attach region;
- attaching a second major die surface of a die onto the die attach region, wherein a first major die surface of the die includes a sensor region, the sensor region is sealed by a protective cover disposed thereover;
- and
- forming a dam structure on the package substrate, wherein the dam structure protects components of the package by preventing contaminants from bleeding beyond the dam structure.
1 more element
Dependencies are inferred from the claim text.