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US 2022/0093480 A1Published application
Mold-in-mold structure to improve solder joint reliability
AssigneeIntel Corporation
InventorKrishna Hemanth VEPAKOMMA
Life of this patent
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Abstract
A semiconductor package comprises a substrate having a first side and the second side, the second side comprising interconnect joints. One or more die stacks are over the first side of the substrate. An inner mold material having a low Young's modulus of less than 2500 MPa encapsulates the one or more die stacks. An outer mold material having a higher Young's modulus encapsulates the inner mold material.
Claims25
A semiconductor package, comprising:
- a substrate having a first side and the second side, the second side comprising interconnect joints;
- one or more die stacks over the first side of the substrate;
- an inner mold material having a low Young's modulus of less than 2500 MPa encapsulating the one or more die stacks;
- and
- an outer mold material having a higher Young's modulus encapsulating the inner mold material.
2 more elements
A package system, comprising:
- a printed circuit board;
- a semiconductor package comprising:
- a substrate having a first side and the second side, the second side comprising an array of solder balls to couple the semiconductor package to the printed circuit board;
- one or more die stacks over the first side of the substrate;
- an inner mold material having a low Young's modulus of less than 2500 MPa encapsulating the one or more die stacks;
- and
- an outer mold material having a higher Young's modulus encapsulating the inner mold material.
4 more elements
A method of fabricating a semiconductor package, the method comprising:
- forming one or more die stacks over a first side of the substrate;
- forming an inner mold material having a low Young's modulus of less than 2500 MPa to encapsulate the one or more die stacks;
- and
- forming an outer mold material having a higher Young's modulus to encapsulate the inner mold material.
1 more element
Dependencies are inferred from the claim text.