Substrate treating apparatus
AssigneeSemes Co., Ltd.
InventorsYong Seok JANG, In Kyu PARK
Life of this patent
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Abstract
Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an index unit including a load pot, in which a container is seated, and an index chamber connected to the load pot, and a process executing unit having a load lock chamber connected to the index chamber and a process chamber that treats a substrate transferred to the load lock chamber, the index unit further includes an alignment unit provided in the index chamber and that aligns a substrate type sensor transferred to the process chamber.
Claims20
A substrate treating apparatus comprising:
- an index unit including a load pot, in which a container is seated, and an index chamber connected to the load pot;
- and
- a process executing unit having a load lock chamber connected to the index chamber and a process chamber configured to treat a substrate transferred to the load lock chamber,
- wherein the index unit further includes:
- an alignment unit provided in the index chamber and configured to align a substrate type sensor transferred to the process chamber.
A substrate treating apparatus comprising:
- a process chamber having a treatment space for treating a substrate;
- an index chamber connected to a load pot, in which a container in which a substrate type sensor that acquires an image of the treatment space is received is seated, and configured to maintain an interior atmosphere at an atmospheric atmosphere;
- at least one transfer robot configured to transfer the substrate or the substrate type sensor between the index chamber and the process chamber;
- and
- an alignment unit provided in the index chamber and configured to align the substrate type sensor.
A substrate treating apparatus comprising:
- an index unit including a load pot in which a container in which a substrate and a substrate type sensor having an image acquiring module are received is seated;
- a process executing unit having a process chamber that treats the substrate;
- and
- a controller,
- wherein the index unit includes:
- an index chamber connected to the load pot and maintained at an atmospheric atmosphere;
- an alignment unit provided in the index chamber and configured to align the substrate type sensor;
- and
- a first transfer robot configured to transfer the substrate or the substrate type sensor between the index chamber and the process executing unit,
- wherein the process executing unit includes:
- a load lock chamber configured to contact the index chamber and an internal atmosphere of which is converted between a vacuum pressure atmosphere and the atmospheric atmosphere;
- a transfer chamber configured to contact the load pot and an internal atmosphere of which is maintained in the vacuum pressure atmosphere;
- and
- a second transfer robot provided in the transfer chamber, and configured to transfer the substrate carried into the load pot or the substrate type sensor to the process chamber, and
- wherein the alignment unit includes:
- a support plate having a support surface that supports the substrate type sensor, and having a suction hole for vacuum-absorbing the substrate type sensor supported on the support surface;
- a rotary shaft configured to rotate the support plate;
- a positioning part configured to move the substrate type sensor supported by the support plate in a first direction and/or a second direction that is perpendicular to the first direction when viewed from a top;
- an irradiation part configured to irradiate light;
- and
- a sensor member configured to receive the light irradiated by the irradiation part and sense a notch formed in the substrate type sensor.
Dependencies are inferred from the claim text.