Reusable die catch materials, reusable die release materials, related die transfer systems, and methods of using the same
AssigneeKulicke & Soffa Netherlands B.V.
InventorsThomas Colosimo, Tao-Hua Lee, Ting-Chia Huang
Life of this patent
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Abstract
A system for transfer of a plurality of die from a die source to a receive substrate is provided. The system includes a die source including a plurality of die, the plurality of die being coupled to a carrier. The system also includes a receive substrate to receive the plurality of die from the die source. The receive substrate includes a die catch material for receiving the plurality of die from the die source, the die catch material being reusable. The system also includes a laser source for providing energy to interact with a die release material to transfer the plurality of die from the die source to the receive substrate.
Claims26
A system for transfer of a plurality of die from a die source to a receive substrate, the system comprising:
- a die source including a plurality of die, the plurality of die being coupled to a carrier;
- a receive substrate to receive the plurality of die from the die source, the receive substrate including a die catch material for receiving the plurality of die from the die source, the die catch material being reusable;
- and
- a laser source for providing energy to interact with a die release material to transfer the plurality of die from the die source to the receive substrate.
A method of transferring a plurality of die from a die source to a receive substrate, the method comprising the steps of:
- (a) coupling a plurality of die to a carrier via a die release material, thereby assembling a die source;
- and
- (b) applying energy to the die release material using a laser to transfer the plurality of die from the die source to a receive substrate, the receive substrate including a die catch material for receiving the plurality of die from the die source, the die catch material being reusable.
A system for transfer of a plurality of die from a die source to a receive substrate, the system comprising:
- a die source including a plurality of die, the plurality of die being coupled to a carrier using a die release material, at least a portion of the die release material being reusable;
- a receive substrate to receive the plurality of die from the die source;
- and
- a laser source for providing energy to interact with the die release material to transfer the plurality of die from the die source to the receive substrate.
A method of transferring a plurality of die from a die source to a receive substrate, the method comprising the steps of:
- (a) coupling a plurality of die to a carrier via a die release material, thereby assembling a die source, at least a portion of the die release material being reusable;
- and
- (b) applying energy to the die release material using a laser to transfer the plurality of die from the die source to a receive substrate.
Dependencies are inferred from the claim text.