Tie bar removal for semiconductor device packaging
AssigneeNXP USA, Inc.
InventorsRichard Te Gan, Rushik Prabhudas Tank, Zhiwei Gong, Burton Jesse Carpenter, Jinmei Liu
Life of this patent
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Abstract
A method of tie bar removal is provided. The method includes forming a leadframe including a tie bar and a flag. The tie bar extends from a side rail of the leadframe and has a distal portion at an angle different from a plane of the flag. A semiconductor die is attached to the flag of the leadframe. A molding compound encapsulates the semiconductor die, a portion of the leadframe, and the distal portion of the tie bar. The tie bar is separated from the molding compound with an angled cavity remaining in the molding compound.
Claims21
1-16. (canceled)
A semiconductor device comprising:
- a leadframe having a plurality of conductive leads and a flag;
- a semiconductor die attached to the flag of the leadframe;
- and
- a molding compound encapsulating the semiconductor die and a portion of the leadframe, an angled cavity formed in the molding compound at an end of the semiconductor device, the angled cavity formed at an angle different from a plane of the flag.
A semiconductor device comprising:
- a leadframe having a plurality of conductive leads and a flag;
- a semiconductor die attached to the flag of the leadframe;
- and
- a molding compound encapsulating the semiconductor die and a portion of the leadframe, an angled cavity formed in the molding compound at an end of the semiconductor device.
A semiconductor device comprising:
- a leadframe having a plurality of conductive leads and a flag;
- a semiconductor die attached to the flag of the leadframe;
- and
- a molding compound encapsulating the semiconductor die and a portion of the leadframe, an angled cavity formed in the molding compound at an end of the semiconductor device, an outermost end of the angled cavity approximately coplanar with a plane of the flag.
Dependencies are inferred from the claim text.