Cleaning substrate method and method of processing substrate using the same

A method of cleaning a substrate, comprising:

• moving a double nozzle comprising a high-pressure nozzle configured to provide a spray and a low-pressure nozzle configured to provide a chemical solution onto the substrate at a first speed on a center region of the substrate, the spray comprising a deionized water and the chemical solution being diluted with the deionized water;
• and
• moving the double nozzle at a second speed, which is slower than the first speed, on an edge region of the substrate outside and surrounding the center region of the substrate,
• wherein the low-pressure nozzle and the high-pressure nozzle are spaced apart from each other by a distance of 7 cm to 12 cm.

A method of processing a substrate, comprising:

• preparing the substrate;
• polishing the substrate;
• and
• cleaning the substrate,
• wherein the cleaning of the substrate comprises:
• cleaning the substrate using a first double nozzle, which is configured to provide a first spray and a first chemical solution onto the substrate, the first spray comprising a deionized water, the first chemical solution being diluted with the deionized water;
• brushing the substrate using a brush and a second chemical solution, which is different from the first chemical solution, on the substrate;
• and
• recleaning the substrate using a second double nozzle, which is configured to provide a second spray and a third chemical solution onto the substrate, which are the same as the first spray and the first chemical solution, respectively,
• wherein a distance between the first chemical solution and the first spray and a distance between the second spray and the third chemical solution are each in a range of 7 cm to 12 cm.