Apparatus for treating substrate
AssigneeSemes Co., Ltd.
InventorDuk Hyun SON
Life of this patent
Estimating the term…
Abstract
An apparatus for treating a substrate includes a process chamber that treats the substrate, a buffer module that accommodates a ring member to be transported into the process chamber, and a load-lock chamber having an inner space. The buffer module includes a buffer chamber having a buffer space in which the ring member is accommodated, a support shelf that supports the ring member in the buffer space, and a drive member that moves the support shelf.
Claims20
An apparatus for treating a substrate, the apparatus comprising:
- a process chamber configured to treat the substrate;
- a buffer module configured to accommodate a ring member to be transported into the process chamber;
- and
- a load-lock chamber having an inner space,
- wherein the buffer module includes:
- a buffer chamber having a buffer space in which the ring member is accommodated;
- a support shelf configured to support the ring member in the buffer space;
- and
- a drive member configured to move the support shelf
An apparatus for treating a substrate, the apparatus comprising:
- a process chamber configured to treat the substrate using plasma;
- a buffer chamber having a buffer space in which a ring member to be transported into the process chamber is accommodated;
- a load-lock chamber having an inner space, the pressure of which is switched between a vacuum atmosphere and an atmospheric atmosphere;
- a support shelf configured to support the ring member in the buffer space;
- and
- a drive member configured to move the ring member between the inner space and the buffer space.
An apparatus for treating a substrate, the apparatus comprising:
- an index unit having a load port on which a carrier having the substrate accommodated therein is seated;
- and
- a process unit having a process chamber configured to treat the substrate using plasma and equipped with a ring member,
- wherein the index unit includes:
- an index chamber provided between the load port and the process unit, the inside of the index chamber being maintained in an atmospheric atmosphere;
- and
- a first transport robot configured to transport the substrate accommodated in the carrier to the process unit, and
- wherein the process unit includes:
- a load-lock chamber having an inner space, the pressure of which is switched between a vacuum atmosphere and an atmospheric atmosphere;
- a buffer chamber disposed over the load-lock chamber, the buffer chamber having a buffer space in which the ring member is accommodated;
- a second transport robot configured to unload the substrate or the ring member from the load-lock chamber and transport the substrate or the ring member into the process chamber;
- a support shelf configured to support the ring member in the buffer space;
- and
- a drive member configured to move the support shelf.
Dependencies are inferred from the claim text.