Method for residue non-uniformity modulation
AssigneeApplied Materials, Inc.
InventorMingle Tong
Life of this patent
Estimating the term…
Abstract
Exemplary semiconductor processing systems may include a chamber body having sidewalls and a base. The systems may include a substrate support extending through the base of the chamber body. The substrate support may include a support plate. The substrate support may include a shaft coupled with the support plate. The chambers may include a bottom plate coupled with the shaft of the substrate support and extending below a bottom surface of the support plate. The bottom plate may include a first emissivity zone and a second emissivity zone. The first emissivity zone and the second emissivity zone may have different emissivity levels.
Claims20
A semiconductor processing system, comprising:
- a chamber body comprising sidewalls and a base;
- a substrate support extending through the base of the chamber body, wherein the substrate support comprises:
- a support plate;
- and
- a shaft coupled with the support plate;
- and
- a bottom plate coupled with the shaft of the substrate support and extending below a bottom surface of the support plate, wherein:
- the bottom plate comprises a first emissivity zone and a second emissivity zone;
- and
- the first emissivity zone and the second emissivity zone have different emissivity levels.
A method of semiconductor processing, comprising:
- flowing one or more precursors into a processing chamber, wherein the processing chamber comprises:
- a substrate support comprising:
- a support plate that supports a semiconductor substrate;
- and
- a shaft coupled with the support plate;
- and
- a bottom plate coupled with the shaft of the substrate support and extending below a bottom surface of the support plate, wherein:
- the bottom plate comprises a first emissivity zone and a second emissivity zone;
- and
- the first emissivity zone and the second emissivity zone have different emissivity levels;
- generating a plasma of the precursor within the processing chamber;
- and
- depositing a material on the semiconductor substrate.
A semiconductor processing system, comprising:
- a chamber body comprising sidewalls and a base;
- a substrate support extending through the base of the chamber body, wherein the substrate support comprises:
- a support plate;
- and
- a shaft coupled with the support plate;
- and
- a bottom plate coupled with the shaft of the substrate support and extending below a bottom surface of the support plate, wherein:
- a top surface of the bottom plate comprises a plurality of light emitting diodes (LEDs) that emit infrared light toward the substrate support.
Dependencies are inferred from the claim text.