Textured silicon semiconductor processing chamber components
OwnerLin XU, Satish SRINIVASAN +5inventors
InventorsLin XU, Satish SRINIVASAN, Robin KOSHY, Amir A. YASSERI, Justin TANG, Jie ZHANG, David Joseph WETZEL
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Abstract
Textured silicon components of a semiconductor processing chamber having hillock-shaped or pyramid-shaped structures on its surface, and a method of texturing such silicon components. The silicon component can be selectively textured using chemical means to form the hillock-shaped structures to increase the surface area of the silicon component to improve polymer adhesion.
Claims37
A component of a semiconductor processing chamber, the component formed of a material comprising silicon and the component comprising a textured outer surface comprising a plurality of hillock-shaped structures.
A component adapted for use in a semiconductor processing chamber, comprising a multi-crystalline silicon body including a textured surface having a surface area, wherein the textured surface comprises an area having a plurality of bumps or pits.
A method for texturing a silicon component of a semiconductor processing chamber, the method comprising:
- providing the silicon component having an outer surface;
- and
- texturing the outer surface to create a plurality of hillock-shaped structures on the outer surface.
A method for manufacturing a multi-crystalline silicon component for use in a semiconductor processing chamber, the method comprising:
- providing a multi-crystalline silicon body having a surface;
- and
- texturing the surface of the multi-crystalline silicon body to form a textured surface having a surface area, wherein the textured surface comprises an area having a plurality of bumps or pits, wherein the plurality of bumps or pits have a height of at least 500 nm.
Dependencies are inferred from the claim text.