Multilayer ceramic electronic component and method of manufacturing the same

A multilayer ceramic electronic component comprising:

• a ceramic body including a laminate body including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and including a dielectric layer, and a first internal electrode and a second internal electrode stacked in the second direction with the dielectric layer interposed therebetween, a first margin portion disposed on the third surface of the laminate body, and a second margin portion disposed on the fourth surface of the laminate body;
• a first connection portion disposed on the first surface of the laminate body;
• and
• a second connection portion disposed on the second surface of the laminate body,
• wherein the first connection portion includes a first lead electrode connected to the first internal electrode and a first ceramic layer disposed on the first lead electrode,
• the second connection portion includes a second lead electrode connected to the second internal electrode and a second ceramic layer disposed on the second lead electrode, and
• the first lead electrode is led out to one surface of the first connection portion in the third direction, and
• the second lead electrode is led out to one surface of the second connection portion in the third direction.

A multilayer ceramic electronic component comprising:

• a ceramic body including a laminate body having a first internal electrode and a second internal electrode stacked with a dielectric layer interposed therebetween;
• a first connection portion including a first lead electrode connected to the first internal electrode, and a first ceramic layer covering the first lead electrode and being in contact with the ceramic body;
• and
• a second connection portion including a second lead electrode connected to the second internal electrode, and a second ceramic layer covering the second lead electrode and being in contact with the ceramic body,
• wherein the first lead electrode includes one end led out to one surface of the first connection portion, and the second lead electrode includes one end led out to one surface of the second connection portion.

A method of manufacturing a multilayer ceramic electronic component, the method comprising:

• forming a body including a laminate body having a first internal conductive paste layer and a second internal conductive paste layer with an internal ceramic paste layer interposed therebetween;
• forming a first conductive paste layer on one surface of the body, and a first ceramic paste layer covering the first conductive paste layer and being in contact with the body;
• forming a second conductive paste layer on another surface of the body, and a second ceramic paste layer covering the second conductive paste layer and being in contact with the body;
• and
• simultaneously sintering the body, the first conductive paste layer, the first ceramic paste layer, the second conductive paste layer, and the second ceramic paste layer,
• wherein a first lead electrode, formed of the first conductive paste layer by the sintering, is connected to a first internal electrode, formed of the first conductive paste layer by the sintering,
• a second lead electrode, formed of the second conductive paste layer by the sintering, is connected to a second internal electrode, formed of the second conductive paste layer by the sintering, and
• the first lead electrode includes an end exposed from a first ceramic layer, formed of the first ceramic paste layer by the sintering, and the second lead electrode includes an end exposed from a second ceramic layer, formed of the second ceramic paste layer by the sintering.