Multilayer capacitor and board having the same mounted thereon

A mounting substrate of a multilayer capacitor, comprising:

• a substrate having first and second electrode pads on an upper surface;
• and
• a multilayer capacitor mounted on the substrate so that first and second plating layers of the multilayer capacitor are connected to the first and second electrode pads, respectively,
• wherein the multilayer capacitor comprises:
• a capacitor body including first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and including a dielectric layer alternately stacked in a first direction connecting the first and second surfaces, a first internal electrode being in contact with the third surface, and a second internal electrode being in contact with the fourth surface;
• first and second external electrodes respectively disposed on both end portions of the capacitor body in a second direction, connecting the third and fourth surfaces, and comprising first and second sintered layers respectively connected to the first and second internal electrodes, and first and second plating layers respectively disposed above the first and second sintered layers, respectively;
• and
• an insulating layer disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer,
• wherein the thickest portion of the insulating layer is 10 μm or more,
• wherein a portion of the first band portion of the first sintered layer extends, in a direction away from the insulating layer, from an edge of an interface between the first sintered layer and the insulating layer,
• wherein a portion of the second band portion of the second sintered layer extends, in another direction away from the insulating layer, from an edge of an interface between the second sintered layer and the insulating layer.

A multilayer capacitor, comprising:

• a capacitor body including first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and including a dielectric layer alternately stacked in a first direction connecting the first and second surfaces, a first internal electrode being in contact with the third surface, and a second internal electrode being in contact with the fourth surface;
• first and second external electrodes respectively disposed on both end portions of the capacitor body, in a second direction connecting the third and fourth surfaces, and comprising first and second sintered layers respectively connected to the first and second internal electrodes, and first and second plating layers respectively disposed above the first and second sintered layers, respectively;
• and
• an insulating layer disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer,
• wherein a portion of the first band portion of the first sintered layer extends, in a direction away from the insulating layer, from an edge of an interface between the first sintered layer and the insulating layer,
• wherein a portion of the second band portion of the second sintered layer extends, in another direction away from the insulating layer, from an edge of an interface between the second sintered layer and the insulating layer,
• wherein a thickness of the insulating layer decreases from a center portion of the insulating layer to an end of the first sintered layer where the insulating layer and the first sintered layer meet or an end of the second sintered layer where the insulating layer and the second sintered layer meet.