Tantalum capacitor and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Ho Hong, Hyun Sub Oh, Youn Soo Kim, Hong Kyu Shin, Hee Sung Choi
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Abstract
A tantalum capacitor includes: first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction; a tantalum body having one surface through which a tantalum wire is exposed in the first direction; and a substrate on which the tantalum body is mounted, wherein the substrate may be an organic-inorganic composite substrate.
Claims37
A tantalum capacitor, comprising:
- first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction;
- a tantalum body having one surface through which a tantalum wire is exposed in the first direction;
- and
- a substrate on which the tantalum body is mounted in the third direction,
- wherein the tantalum capacitor comprises,
- wherein the substrate is an organic-inorganic composite substrate.
A manufacturing method of a tantalum capacitor, comprising operations of:
- etching a resist layer on a base film in which a carrier film, a base metal layer, and a first resist layer are sequentially stacked;
- and
- forming a first plating layer on the etched portion of the base film.
A manufacturing method of a tantalum capacitor, comprising operations of:
- forming and etching a first resist layer on a base film in which a carrier film, a base metal layer, and a first metal layer are sequentially stacked;
- and
- etching the first metal layer exposed to the etched portion of the base film.
A tantalum capacitor, comprising:
- a tantalum body having one surface through which a tantalum wire is exposed in a first direction;
- and
- a substrate on which the tantalum body is mounted in a second direction,
- wherein the substrate includes first and second resist layers, stacked one another in the second direction, and first and second through-holes penetrating the first and second resist layers in the second direction, and
- two layers of positive electrodes are disposed in the first through-hole and two layers of negative electrodes are disposed in the second through-hole.
Dependencies are inferred from the claim text.