Chip-on film package and display device including the same
AssigneeSamsung Display Co., Ltd.
InventorsTae Gon IM, Min Soo CHOI, Ji Hyun KIM, Jun Pyo LEE
Life of this patent
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Abstract
The display device includes a display panel, a printed circuit board on which a timing controller is mounted, and a connection film on which a data driver is mounted. Pixels and a gate driving circuit are disposed in a display area of the display panel. The connection film includes output lines connecting the data driver and the display panel, and first connection lines connecting the printed circuit board and the display panel. The first connection lines overlap the first area on which the data driver is mounted and are disposed between the output lines.
Claims20
A display device comprising:
- a display panel including data lines, gate lines, clock lines disposed between the data lines, pixels connected to the data lines and the gate lines in a display area, and a gate driving circuit connected to the clock lines and the gate lines in the display area;
- a printed circuit board on which a timing controller is mounted;
- and
- a connection film on which a data driver is mounted, connecting the timing controller and the data driver, connecting the data driver and the data lines, and connecting the timing controller and the clock lines,
- wherein the connection film includes:
- a base film including a first area on which the data driver is mounted and a second area surrounding the first area;
- first input terminals and second input terminals disposed on one side of the base film and connected to the timing controller;
- first output terminals disposed on another side of the base film and connected to the data lines;
- second output terminals disposed on the another side of the base film and connected to the clock lines;
- input lines extending from the first input terminals to the first area;
- output lines extending from the first output terminals to the first area;
- and
- first connection lines overlapping the first area in a plan view and connecting the second input terminals to the second output terminals, and
- wherein the first connection lines are disposed between the output lines.
A chip-on film package that is electrically connected between two substrates, comprising:
- a base film including a first area on which an integrated circuit is mounted and a second area surrounding the first area;
- first input terminals and second input terminals disposed on one side of the base film;
- first output terminals and second output terminals disposed on another side of the base film;
- input lines extending from the first input terminals to the first area;
- output lines extending from the first output terminals to the first area;
- and
- first connection lines overlapping the first area in a plan view and connecting the second input terminals to the second output terminal,
- wherein the first connection lines and the output lines are alternately disposed.
Dependencies are inferred from the claim text.