Off-package high density, high bandwidth memory access using optical links

A package comprising:

• an optical physical layer (PHY) die;
• a system on chip (SOC) electrically coupled with the PHY die, wherein the SOC includes:
• a memory controller;
• and
• memory coupled with the memory controller;
• and
• wherein the optical PHY die is to optically couple with a PHY die on another package to use an optical link to provide high-bandwidth memory access between the SOC and the other package.

A method for accessing high-bandwidth, high-density memory, the method comprising:

• identifying a system on chip (SOC) package that includes:
• a processor;
• and
• an optical physical layer (PHY) die electrically coupled with the processor;
• identifying a large optically connected memory device (LOCM) package that includes:
• a memory controller coupled with the optical PHY die;
• and
• memory coupled with the memory controller;
• and
• optically coupling the optical PHY die of the SOC with the optical PHY die of the LOCM to allow the processor to access high-density memory on the LOCM at a high-bandwidth speed.

A system comprising:

• a system on chip (SOC) that includes:
• a processor;
• and
• an optical physical layer (PHY) die electrically coupled with the processor;
• a large optically connected memory device (LOCM) that includes:
• a memory controller coupled with the optical PHY die;
• and
• memory coupled with the memory controller;
• and
• wherein the SOC and the LOCM are optically coupled to allow the processor to access the memory on the LOCM.