Translation circuitry for an interconnection in a semiconductor package
AssigneeIntel Corporation
InventorsLai Guan Tang, Ankireddy Nalamalpu, Dheeraj Subbareddy, Chee Hak Teh, MD Altaf Hossain
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Abstract
Systems and method include one or more die coupled to an interposer. The interposer includes interconnection circuitry configured to electrically connect the one or more die together via the interposer. The interposer also includes translation circuitry configured to translate communications as they pass through the interposer. For instance, in the interposer, the translation circuitry translates communications, in the interposer, from a first protocol of a first die of the one or more die to a second protocol of a second die of the one or more die.
Claims20
A system, comprising:
- a plurality of die;
- an active interposer coupled to the plurality of die, wherein the active interposer comprises translation circuitry configured to:
- receive data from a first die of the plurality of die using a first frequency;
- translate the data received using the first frequency to a second frequency associated with a second die of the plurality of die;
- and
- transmit the data to the second die with the second frequency.
A method, comprising:
- receiving, at an active interposer, data from a first die coupled to the active interposer, wherein the data is received from the first die using a first frequency;
- translating, by the active interposer, the first frequency of the first data to a second frequency associated with a second die coupled to the active interposer;
- and
- transmitting, by the active interposer, the data to the second die with the second frequency.
An active interposer for a plurality of die, comprising:
- routing circuitry configured to electrically connect the plurality of die together;
- and
- translation circuitry configured to translate a first frequency of data received from a first die of the plurality of die to a second frequency associated with a second die of the plurality of die.
Dependencies are inferred from the claim text.