Thermal-Control System for a Security Camera and Associated Security Camera
AssigneeGoogle Inc.
InventorsIhab A. Ali, Arun Prakash Raghupathy, Mark Benjamin Kraz, Kok Yen Cheng, Chi-Ming Lin
Life of this patent
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Abstract
This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.
Claims20
A thermal-control system for a security camera, the thermal-control system comprising:
- a first thermal-control subsystem, the first thermal-control subsystem configured to transfer a first quantity of heat to a housing, the first thermal-control subsystem including:
- a first thermal interface material, the first thermal interface material located between a system-on-chip integrated circuit device and a first heat sink, the system-on-chip integrated circuit device mounted to a first surface of a first printed circuit board;
- a second thermal interface material, the second thermal interface material located between a memory integrated circuit device and the first heat sink, the memory integrated circuit device mounted to the first surface of the first printed circuit board;
- and
- a third thermal interface material, the third thermal interface material located between a second surface of the first printed circuit board and a second heat sink, the second surface of the first printed circuit board opposite the first surface of the first printed circuit board;
- and
- a second thermal-control subsystem, the second thermal-control subsystem configured to transfer a second quantity of heat to the housing, the second thermal-control subsystem including:
- a fourth thermal interface material, the fourth thermal interface material located between a second surface of a second printed circuit board and a heat spreader, the second surface of the second printed circuit board opposite a first surface of the second printed circuit board to which a passive infrared sensor integrated circuit device and an image sensor integrated circuit device are mounted.
A security camera comprising:
- a system-on-chip integrated circuit device that is mounted to a first surface of a first printed circuit board;
- a memory integrated circuit device that is mounted to the first surface of the first printed circuit board;
- a battery;
- and
- a thermal-control system configured to concurrently maintain temperatures throughout the security camera during a high thermal-loading condition, the thermal-control system configured to concurrently maintain:
- a first temperature of a first thermal zone at or below a first prescribed temperature threshold, the first thermal zone including the system-on-chip integrated circuit device;
- a second temperature of a second thermal zone at or below a second prescribed temperature threshold, the second thermal zone including the memory integrated circuit device;
- and
- a third temperature of a third thermal zone at or below a third prescribed temperature threshold, the third thermal zone including the battery.
Dependencies are inferred from the claim text.