Test structure, substrate and method for manufacturing substrate
AssigneesHkc Corporation Limited, Chongqing Hkc Optoelectronics Technology Co., Ltd.
InventorsKaijun LIU, En-Tsung CHO
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Abstract
The present application discloses a test structure, a substrate and a method for manufacturing the substrate. The substrate includes a stacked substratum, a metal layer and an insulating layer; first via holes and second via holes disposed in different areas and passing through the insulating layer, and first transparent electrodes and second transparent electrodes disposed in different via holes and connected with the metal layer. The first via holes and the second via holes are formed through the same manufacture procedure, and the first transparent electrodes and the second transparent electrodes are formed through the same manufacture procedure.
Claims20
A substrate, divided into at least one display substrate area and an interval area located between the display substrate area, the interval area is provided with at least one test area, the substrate comprising:
- a substratum;
- a metal layer disposed on the substratum;
- an insulating layer disposed on the metal layer;
- a plurality of first via holes disposed in the display substrate area and passing through the insulating layer of the display substrate area;
- at least one second via hole disposed in the test area and passing through the insulating layer of the test area;
- first transparent electrodes disposed on the insulating layer of the display substrate area and in the first via holes and connected with the metal layer;
- and
- second transparent electrodes disposed in the second via holes and connected with the metal layer;
- wherein, the first via holes and the second via holes are formed through the same manufacture procedure, and the first transparent electrodes and the second transparent electrodes are formed through the same manufacture procedure.
A test structure configured for testing a display substrate area of a substrate, comprising second via holes synchronously formed with first via holes of the display substrate area, second transparent electrodes synchronously formed with first transparent electrodes of the display substrate area, and at least one conductor and at least two pads, wherein
- the test structure comprises more than one second via holes, the second transparent electrodes are disposed in the second via holes, the conductors connect the second transparent electrodes in different second via holes, and the pads are connected with the second transparent electrodes or the conductors.
A method for manufacturing a substrate, comprising:
- forming a substratum in a display substrate area of a substrate and in a test area positioned outside the display substrate area;
- forming a metal layer on the substratum;
- forming an insulating layer on the metal layer;
- synchronously forming a plurality of first via holes and at least one second via hole, wherein the first via holes pass through the insulating layer of the display substrate area, and the second via holes pass through the insulating layer of the test area;
- synchronously forming first transparent electrodes and second transparent electrodes, wherein the first transparent electrodes are formed on the insulating layer of the display substrate area and in the first via holes, the second transparent electrodes are formed in the second via holes, and the first transparent electrodes and the second transparent electrodes are separately connected with the metal layer;
- and
- testing the second via holes and the second transparent electrodes in the test area.
Dependencies are inferred from the claim text.