Electronic-photonic integrated circuit based on silicon photonics technology
AssigneeElectronics and Telecommunications Research Institute
InventorsSanghwa YOO, Heuk PARK, Jyung Chan LEE, Joon Ki LEE
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Abstract
Disclosed is a silicon photonics-based electronic-photonic integrated circuit (EPIC). The silicon photonics-based EPIC includes a silicon photonic integrated circuit (PIC) chip in which an optical device is mounted on a silicon-on-insulator (SOI) wafer including a trench region, an electronic integrated circuit (EIC) chip mounted in the trench region of the PIC chip, and an electrical interface configured to connect an electrode pad of the PIC chip and an electrode pad of the EIC chip.
Claims17
A silicon photonics-based electronic-photonic integrated circuit (EPIC), the EPIC comprising:
- a silicon photonic integrated circuit (PIC) chip in which an optical device is mounted on a silicon-on-insulator (SOI) wafer comprising a trench region;
- an electronic integrated circuit (EIC) chip mounted in the trench region of the PIC chip;
- and
- an electrical interface configured to connect an electrode pad of the PIC chip and an electrode pad of the EIC chip.
A silicon photonics-based electronic-photonic integrated circuit (EPIC), the EPIC comprising:
- a silicon photonic integrated circuit (PIC) chip in which an optical device is mounted on a silicon-on-insulator (SOI) wafer comprising a first trench region and a second trench region;
- an electronic integrated circuit (EIC) chip mounted in the first trench region of the PIC chip;
- an electrical interface configured to connect an electrode pad of the PIC chip and an electrode pad of the EIC chip;
- and
- an N-channel fiber array block (FAB) having one or more channels mounted in the second trench region of the PIC chip.
A silicon photonics-based electronic-photonic integrated circuit (EPIC), the EPIC comprising:
- a silicon photonic integrated circuit (PIC) chip in which an optical device is mounted on a silicon-on-insulator (SOI) wafer comprising a trench region;
- an electronic integrated circuit (EIC) chip mounted in the trench region of the PIC chip;
- an electrical interface configured to connect an electrode pad of the PIC chip and an electrode pad of the EIC chip;
- and
- a printed circuit board (PCB) comprising a thermally conductive via disposed at a bottom of the PIC chip.
Dependencies are inferred from the claim text.