Magnetic field sensor on integrated circuit

Abstract

A magnetic field sensor comprises a signal conditioning IC and a magnetic field sensor IC, the magnetic field sensor IC being mounted on and connected to the signal conditioning IC. The magnetic field sensor IC comprises a semi-conductor substrate with a sensor active layer disposed an outer facing side of the magnetic field sensor opposite the signal conditioning IC. The sensor active layer is connected to conductive vias that extend through the semi-conductor substrate from said outer facing side to an underside facing the signal conditioning IC, an underside of the conductive via being electrically interconnected to a connection pad on the signal conditioning IC via a chip-on-chip interconnection comprising a conductive bead connection and a solder connection.

Dependencies are inferred from the claim text.