Cooling unit, objective lens module, semiconductor inspection device, and semiconductor inspection method

2:

• The cooling unit according to claim 1, wherein the jacket is further provided with a discharge flow path through which the fluid discharged from the space flows.

3:

• The cooling unit according to claim 1, wherein
• the jacket is further provided with a coolant flow path through which a coolant for cooling the jacket flows.

4:

• The cooling unit according to claim 1, wherein the space defining surface extends so as to surround the light passing portion.

5:

• The cooling unit according to claim 1, wherein the space defining surface extends in a plane shape.

6:

• The cooling unit according to claim 1, wherein the space defining surface is continuous with the light passing portion.

7:

• The cooling unit according to claim 1, wherein the space defining surface is a bottom surface of a recess formed in the jacket.

8:

• The cooling unit according to claim 1, wherein the thickness of the space is not less than 0.05 mm and not more than 0.5 mm.

9:

• The cooling unit according to claim 1, wherein the thickness of the space is more than 0 mm and not more than 0.05 mm or less.

10:

• The cooling unit according to claim 1, further comprising an elastic member that is sandwiched between the jacket and a stage on which the semiconductor device is disposed and seals the space.

11:

• The cooling unit according to claim 1, wherein the jacket is provided with at least two of the supply flow paths.

12:

• The cooling unit according to claim 2, wherein, when viewed from a direction perpendicular to the space defining surface, a position at which the fluid is supplied from the supply flow path to the space is located inside a position at which the fluid is discharged from the space to the discharge flow path.

13:

• The cooling unit according to claim 1, wherein the supply flow path is configured to discharge the fluid toward the light passing portion.

14:

• The cooling unit according to claim 1, wherein at least one of a recessed portion and a protruding portion is formed on the space defining surface.

15:

• The cooling unit according to claim 1, wherein the light passing portion is configured by disposing a light transmitting member in an opening provided to the jacket.

16:

• The cooling unit according to claim 15, wherein the light transmitting member closes the opening in a watertight manner.

18:

• The objective lens module according to claim 17, further comprising a biasing member that biases the cooling unit toward a side opposite to the objective lens.

19:

• The objective lens module according to claim 17,
• further comprising a holder attached to the objective lens and holding the solid immersion lens,
• wherein the holder has a flexible member that is in contact with a peripheral portion of the solid immersion lens and holds the solid immersion lens in a watertight and swingable manner.

23:

• The semiconductor inspection device according to claim 22, wherein the controller controls the pressure adjuster such that a pressure of the fluid flowing through the space is lower than a pressure outside the cooling unit.

24:

• The semiconductor inspection device according to claim 21, further comprising a biasing device that biases the cooling unit toward the stage.