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US 2022/0090631 A1Published application
Sliding member
AssigneeTaiho Kogyo Co., Ltd.
InventorShigeyuki SUGA
Life of this patent
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Abstract
[Object] Provided is a technique capable of reducing the possibility of generation of a Cu—Sb compound in an overlay and the possibility of delamination between layers. [Solution] A sliding member includes: an overlay including an alloy plating film of Bi and Sb; a lining including an Al alloy; a first intermediate layer including Cu as a main component, and laminated on the lining; and a second intermediate layer including Ag as a main component, and connecting the first intermediate layer and the overlay.
Claims2
A sliding member comprising:
- an overlay including an alloy plating film of Bi and Sb;
- a lining including an Al alloy;
- a first intermediate layer including Cu as a main component, and laminated on the lining;
- and
- a second intermediate layer including Ag as a main component, and connecting the first intermediate layer and the overlay.
2 more elements
Dependencies are inferred from the claim text.