Electrodeposition of a cobalt or copper alloy, and use in microelectronics
Assigneeaveni
InventorsVincent MEVELLEC, Louis CAILLARD, Mikaïlou THIAM, Dominique SUHR
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Abstract
Electrodeposition of a cobalt or copper alloy, and use in microelectronics The present invention relates to a process for fabricating cobalt or copper interconnects, and to an electrolyte enabling implementation of said process. The electrolyte, with a pH of less than 4.0, comprises cobalt or copper ions, chloride ions, manganese or zinc ions, and at most two organic additives of low molecular mass. One of these additives may be an alpha-hydroxy carboxylic acid.
Claims13
Electrolyte for electrodeposition of an alloy of a first metal selected from cobalt, copper and mixtures thereof, and a second metal selected from manganese, zinc and mixtures thereof, characterized in that the electrolyte is an aqueous solution comprising :
- cobalt II ions or copper II ions in a mass concentration of from 1 g/L to 5 g/L,
- chloride ions in a mass concentration of from 1 g/L to 10 g/L,
- metal ions selected from manganese II ions and zinc II ions, said metal ions being in a mass concentration such that the ratio between the mass concentration of cobalt II ions or of copper II ions and the mass concentration of metal ions is from 1/10 to 25/1,
- an organic acid or an inorganic acid in an amount sufficient to obtain a pH for the electrolyte being between 1.8 and 4.0, and
- just one or at most two organic additives which are not polymers, wherein said organic additive, one of the two organic additives or the two organic additives may be the organic acid if present in the composition, and wherein the concentration of the organic additive or the sum of the concentrations of the two organic additives is between 5 mg/L and 200 mg/L.
Electrochemical process for filling cavities, said cavities having an average width or an average diameter at the opening of between 15 nm and 100 nm and a depth of between 50 nm and 250 nm, said process comprising:
- a step of contacting a conductive surface of said cavities with an electrolyte in accordance with one of the preceding claims,
- a step of polarizing the conductive surface for a period of time sufficient to carry out the conformal and complete filling of the cavities by deposition of an alloy of a first metal selected from cobalt, copper and mixtures thereof and a second metal selected from manganese, zinc and mixtures thereof, and
- a step of annealing the deposit of the alloy obtained at the end of the polarization step, said annealing being carried out at a temperature allowing the second metal to migrate to form a first layer which predominantly contains the second metal and is in contact with the conductive surface, said layer having a thickness of between 0.5 nm and 2 nm, and a second layer which contains essentially cobalt or copper and covers the surface of the first layer, the second layer not being in contact with the conductive surface.
Dependencies are inferred from the claim text.