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AssigneeKokusai Electric Corporation
InventorsYuji SAIKI, Tomoshi TANIYAMA, Akinori TANAKA
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Some embodiments of the present disclosure provide a technique capable of improving a film thickness uniformity on a surface of a substrate and between substrates. According to one or more embodiments, there is provided a technique that includes: a vaporizer configured to generate a source gas by vaporizing a liquid source; a tank in which the source gas ejected from the vaporizer is stored; a flow controller provided at a pipe connecting the vaporizer with the tank; a first valve provided at the pipe; a second valve provided downstream of the tank; a process chamber downstream of the second valve and to which the source gas is supplied; and a controller configured to be capable of controlling the first valve and the second valve to alternately and repeatedly perform accumulation of the source gas from the vaporizer into the tank and release of the source gas from the tank to the process chamber.
A substrate processing apparatus comprising:
A method of manufacturing a semiconductor device, comprising:
A non-transitory tangible medium storing a program that causes, by a computer, a substrate processing apparatus to perform:
Dependencies are inferred from the claim text.