Free-cutting copper alloy and method for manufacturing free-cutting copper alloy
AssigneeMitsubishi Materials Corporation
InventorsKeiichiro Oishi, Kouichi Suzaki, Hiroki Goto
Life of this patent
Estimating the term…
Loading patent…
AssigneeMitsubishi Materials Corporation
InventorsKeiichiro Oishi, Kouichi Suzaki, Hiroki Goto
Estimating the term…
This free-cutting copper alloy includes Cu: more than 61.0% and less than 65.0%, Si: more than 1.0% and less than 1.5%, Pb: 0.003% to less than 0.20%, and P: more than 0.003% and less than 0.19%, with the remainder being Zn and unavoidable impurities, a total content of Fe, Mn, Co, and Cr is less than 0.40%, a total content of Sn and Al is less than 0.40%, a relationship of 56.5≤f1=[Cu]−4.5×[Si]+0.5×[Pb]−[P]≤59.5 is satisfied, constituent phases of a metallographic structure have relationships of 20≤(α)≤80, 15≤(β)≤80, 0≤(γ)<8, 18×(γ)/(β)<9, 20≤(γ)1/2×3+(β)×([Si])1/2≤88, and 33≤(γ)1/2×3+(β)×([Si])1/2+([Pb])1/2×35+([P])1/2×15, and a compound including P is present in β phase.
A free-cutting copper alloy comprising:
A free-cutting copper alloy comprising:
Dependencies are inferred from the claim text.