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US 2022/0089930 A1Published application
Anisotropic heat-conducting resin member and heat-transmitting substrate
AssigneesShowa Denko Materials Co., Ltd., The University of Tokyo
InventorsYoshitaka TAKEZAWA, Masahiro NOMURA
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Abstract
One aspect of the present invention is an anisotropic heat-conducting resin member provided with a first fiber group including multiple stretched thermoplastic resin fibers that have been bundled and a second fiber group and a third fiber group that the first fiber group branches to.
Claims9
An anisotropic heat-conducting resin member comprising a first fiber group with multiple stretched thermoplastic resin fibers that are bundled, and a second fiber group and a third fiber group that the first fiber group branches to.
Dependencies are inferred from the claim text.