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US 2022/0089916 A1Published application
Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same
AssigneeLG Chem, Ltd.
InventorsJong Min JANG, Kwang Joo LEE, Yu Lin SUN
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Abstract
The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.
Claims10
An adhesive resin composition for a semiconductor containing:
- a polymer matrix comprising a (meth)acrylate-based resin comprising a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit (BzMA) containing an aromatic functional group, a curing agent comprising a phenolic resin, and an epoxy resin;
- and
- a magnetic filler dispersed in the polymer matrix and comprising a core and a coating layer formed on a surface of the core,
- wherein the coating layer comprises at least one material selected from the group consisting of yttrium oxide, magnesium oxide, aluminum oxide, silicon oxide, and ferrite.
1 more element
Dependencies are inferred from the claim text.