Re-workable adhesives for electronic devices
AssigneeHewlett-Packard Development Company, L.P.
InventorsKuan-Ting Wu, Super Liao, Chung-Hua Ku
Life of this patent
Estimating the term…
Abstract
The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.
Claims15
A re-workable adhesive for an electronic device comprising:
- a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive, wherein the holt-melt adhesive has a reduced bond strength at an elevated temperature;
- and
- a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.
An electronic device comprising:
- a cover portion;
- a display component;
- and
- a re-workable adhesive adhering the display component to the cover portion, wherein the re-workable adhesive comprises:
- a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive, wherein the holt-melt adhesive has a reduced bond strength at an elevated temperature;
- and
- a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.
A method of making an electronic device comprising:
- gluing a display component onto a cover portion using a re-workable adhesive, wherein the re-workable adhesive comprises:
- a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive, wherein the holt-melt adhesive has a reduced bond strength at an elevated temperature;
- and
- a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.
Dependencies are inferred from the claim text.