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US 2022/0089907 A1Published application
Polishing composition
AssigneeFujimi Incorporated
InventorsYukinobu Yoshizaki, Hirofumi Ikawa
Life of this patent
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Abstract
Provided is a polishing composition in which a polishing speed of silicon germanium is sufficiently high and a selection ratio of the polishing speed of silicon germanium is sufficiently high. A polishing composition includes: abrasive grains; an inorganic salt; and an oxidizing agent, in which the number of silanol groups per unit surface area of the abrasive grains is more than 0/nm2 and 2.0/nm2 or less, and a pH of the polishing composition is 6.0 or more.
Claims11
A polishing composition comprising:
- abrasive grains;
- an inorganic salt;
- and
- an oxidizing agent,
- wherein the number of silanol groups per unit surface area of the abrasive grains is more than 0/nm2 and 2.0/nm2 or less, and
- a pH of the polishing composition is 6.0 or more.
3 more elements
Dependencies are inferred from the claim text.