Back to results
US 2022/0089351 A1Published application
Laminate, blister pack, press-through package, and laminate manufacturing method
AssigneeFujimori Kogyo Co., Ltd.
InventorsHajime OKAMOTO, Toyoaki SUZUKI
Life of this patent
Estimating the term…
Abstract
A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in that order, in which the substrate layer contains any one or more kinds of a polyolefin-based resin, a polyester-based resin or a vinyl-based resin, the intermediate layer contains a polyethylene resin and a modified polyethylene resin, and the intermediate layer has a thickness of 5 μm or more and 50 μm or less.
Claims4
A laminate comprising a substrate layer, an intermediate layer, and a fluorine-based resin layer in that order, wherein
- said substrate layer contains any one or more kinds of a polyolefin-based resin, a polyester-based resin or a vinyl-based resin,
- said substrate layer has a thickness of 45 μm or more and 220 μm or less,
- said intermediate layer consists essentially of a linear low density polyethylene and a maleic anhydride-modified polyethylene,
- a mixing ratio of the linear low density polyethylene and the maleic anhydride-modified polyethylene ([linear low density polyethylene]:[maleic anhydride-modified polyethylene]) is 10:90 to 50:50,
- said intermediate layer has a thickness of 10 μm or more and 30 μm or less,
- said fluorine-based resin layer has a thickness of 40 μm or more and 150 μm or less, and said laminate has a water vapor permeability of 0.5 g/m2/24 hours or less.
3 more elements
Dependencies are inferred from the claim text.