Temperature prediction in three-dimensional (3d) parts
AssigneeHewlett-Packard Development Company, L.P.
InventorsSunil Kothari, Tod Heiles, Juan Carlos Catana Salazar, Jun Zeng, Gary J. Dispoto
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Abstract
Systems and methods of predicting temperature during a build of a three-dimensional (3D) part include determining a temperature profile at a plurality of layers of a part based on geometric characteristics of the 3D part as defined by a 3D part file, and adjusting a process parameter of the build based on the determined temperature.
Claims15
A method of predicting temperature during a build of a three-dimensional (3D) part, comprising:
- determining a temperature profile at a plurality of layers of a part based on geometric characteristics of the 3D part as defined by a 3D part file;
- and
- adjusting a process parameter of the build based on the determined temperature.
A non-transitory computer readable medium comprising computer usable program code embodied therewith, the computer usable program code to, when executed by a processor:
- determine a temperature profile at a plurality of layers of a part based on geometric characteristics of the 3D part as defined by a 3D part file;
- adjust a process parameter of the build based on the determined temperature;
- and
- print the part using the adjusted process parameter.
A system for predicting temperature during a build of a three-dimensional (3D) part, comprising:
- a part analysis module to determine a number of geometric characteristics of a 3D part based on data within a 3D part file;
- and
- a measuring module to determine a temperature profile at a plurality of layers of the part based on the geometric characteristics of the 3D part.
Dependencies are inferred from the claim text.