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US 2022/0088710 A1Published application
Electronic component and manufacturing method of the same
AssigneeNidec Copal Electronics Corporation
InventorsTadashi Komuro, Syoto Kitsu
Life of this patent
Estimating the term…
Abstract
An electronic component includes a housing and a cover. The housing includes a concave portion accommodating therein elements. The cover covers the concave portion. A laser-welded portion including a discontinuous portion is provided along a circumference of the concave portion of the housing and fixes the cover to the housing.
Claims7
An electronic component comprising:
- a housing including a concave portion in which elements are to be accommodated;
- a cover which covers the concave portion;
- and
- a laser-welded portion provided along a circumference of the concave portion of the housing, fixing the cover to the housing, and including a discontinuous portion.
1 more element
A manufacturing method of an electronic component comprising:
- providing, to a housing including a concave portion accommodating therein elements, a cover used to cover the concave portion;
- and
- applying laser light from the cover side to thereby form, along a circumference of the concave portion of the housing, a laser-welded portion fixing the cover to the housing and including a discontinuous portion.
Dependencies are inferred from the claim text.