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US 2022/0088644 A1Published application
Unit for removing adhesive layer and method using the same
AssigneeSemes Co., Ltd.
InventorsSEUNG HOON OH, JIN MO JAE, HWAN BIN KIM
Life of this patent
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Abstract
A unit for removing an adhesive layer formed in a processing chamber includes an ultrasonic generator, and a wiper soaked in a cleaning liquid. The wiper is provided to surround the ultrasonic generator.
Claims10
A unit for removing an adhesive layer formed in a processing chamber, the unit comprising:
- an ultrasonic generator;
- and
- a wiper soaked in a cleaning liquid,
- wherein the wiper is provided to surround the ultrasonic generator.
1 more element
-20. (canceled)
Dependencies are inferred from the claim text.