Systems and methods for inkjet or laser based pick and place machine at high speed
AssigneeIO Tech Group Ltd.
InventorsMichael Zenou, Ziv Gilan, Guy Nesher
Life of this patent
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AssigneeIO Tech Group Ltd.
InventorsMichael Zenou, Ziv Gilan, Guy Nesher
Estimating the term…
In a first approach, a vacuum cell comprises a porous plate and a vacuum force generated by gas being drawn thorough the porous plate is used to pick electronic components from a donor substrate. After transport of the vacuum cell to a placing area, dots of liquid material may be deposited on a top surface of the porous plate adjacent to one or more picked components in order to disrupt the vacuum force and release the picked components onto a receiving substrate. In a refinement of the first approach, the porous plate contains a plurality of picking holes for selectively picking components. Certain picking holes can be fluidly coupled to the vacuum, allowing components to be attached within those picking holes, while other picking holes can be closed or rendered inactive with dots of liquid material deposited on a top surface of the porous plate.
A system for surface mounting electronic components on a printed circuit board, the system comprising:
A method for surface mounting electronic components on a printed circuit board or other substrate, the method comprising:
A system for surface mounting electronic components on a printed circuit board, the system comprising a vacuum cell configured for picking the electronic components, said vacuum cell having a picking substrate and an inkjet print head disposed so as to print dots of liquid material above selected ones of a plurality of picking holes in the picking substrate.
A method, comprising:
Dependencies are inferred from the claim text.