Liquid cooling device and manufacturing method thereof
AssigneeCooler Master Co., Ltd.
InventorsWei-Pin LIN, Zhong-Long ZHU, Yi-Cheng CHEN
Life of this patent
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Abstract
A liquid cooling device includes a thermally conductive base, a cover, and a metallic partition. The thermally conductive base has a fluid chamber and a plurality of fins. The fins are located in the fluid chamber and protrudes from an inner surface of the thermally conductive base facing the fluid chamber. Every two of the fins located adjacent to each other define a channel therebetween. Distal ends of at least part of the fins located away from the inner surface together form a covering structure partially coving the channels. The metallic partition is located between and welded to the covering structure and the cover.
Claims8
A liquid cooling device, comprising:
- a thermally conductive base, having a fluid chamber and a plurality of fins, wherein the plurality of fins are located in the fluid chamber and protrudes from an inner surface of the thermally conductive base facing the fluid chamber, every two of the plurality of fins located adjacent to each other define a channel therebetween, distal ends of at least part of the plurality of fins located away from the inner surface together form a covering structure partially covering the channel;
- a cover, having an inlet and an outlet, wherein the cover is mounted on the thermally conductive base and covers the fluid chamber, and the inlet is in fluid communication with the outlet via the fluid chamber;
- and
- a metallic partition, located between and welded to the covering structure and the cover.
A manufacturing method of a liquid cooling device, comprising:
- forming a plurality of fins on a thermally conductive base;
- forming a covering structure on ends of the plurality of fins, wherein the covering structure partially covers a plurality of channels between the plurality of fins;
- and
- welding a metallic partition on the covering structure.
Dependencies are inferred from the claim text.