Server device

A server device, comprising:

• a casing, comprising a housing and a partition, wherein the partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing;
• an electronic assembly, located in the accommodation space;
• and
• a heat dissipation assembly, comprising a heat dissipation component and a heat pipe, wherein the heat dissipation component is located in the heat dissipation space, the heat pipe comprises a heat absorption portion and a condensation portion connected to each other, the heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component;
• wherein the partition has a plurality of through holes, the accommodation space is communicated with the heat dissipation space via the plurality of through holes, the housing has a plurality of first vent holes, and sizes of the plurality of through holes is smaller than sizes of the plurality of first vent holes.