Multilayer screen printing stencil
AssigneeInternational Business Machines Corporation
InventorsJia Yu Zheng, WeiFeng Zhang, YanLong Hou, Guo Wei, Zhipeng Wang, Miao Zhang
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Abstract
A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.
Claims20
A method of forming solder paste on an object, the method comprising:
- providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer;
- applying the stencil to a surface of the object;
- filling a void space formed by a combination of the apertures in the stencil layers with solder paste;
- and
- removing the stencil layers in a sequential manner to leave the solder paste.
A multilayered stencil for applying solder paste to a surface of an object, the stencil comprising:
- a plurality of stencil layers formed in a stacked configuration, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer;
- wherein aperture sizes of the stencil layers gradually decrease in a direction away from the surface of the object.
Dependencies are inferred from the claim text.