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US 2022/0071013 A1Published application
Wafer-Level Passive Array Packaging
AssigneeApple Inc.
InventorsScott D. Morrison, Karthik Shanmugam, Raymundo M. Camenforte, Rakshit Agrawal, Flynn P. Carson, Kiranjit Dhaliwal
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Abstract
Wafer level passive array packages, modules, and methods of fabrication are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.
Claims22
A module comprising:
- a circuit board including a top side including a first plurality of landing pads;
- and
- a package mounted on the circuit board and bonded to the first plurality of landing pads, the package including:
- a die;
- and
- a plurality of passive components bonded to a bottom side of the die and the first plurality of landing pads of the circuit board;
- wherein the plurality of passive components is directly underneath the die.
4 more elements
Dependencies are inferred from the claim text.