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US 2022/0071009 A1Published application
Coaxial thru-via conductor configurations in electronic packaging substrates
OwnerTimothy Leigh LeClairinventor
Life of this patent
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Abstract
A coaxial thru-via conductor and a method of fabricating the coaxial thru-via conductor can provide enhanced operations for semiconductor devices mounted on a substrate.
Claims9
A coaxial thru-via conductor on a substrate, comprising:
- a first thru-via in the substrate having an inner wall diameter of D1;
- a first liner ring of conductive material deposited on the interior wall of the thru-via and having an inner diameter of D2<D1;
- a first liner ring of dielectric material deposited on the interior wall of the first conductive material and having an interior diameter of D3<D2;
- and
- a conductive material deposited on the interior wall of the first layer of dielectric material and filling the remaining interior of the thru-via.
2 more elements
A coaxial thru-via conductor on a substrate, comprising:
- a first thru-via in the substrate having an inner wall diameter of D1;
- a first liner ring of dielectric material coaxially adjacent the inner wall of the first thru-via and having an inner diameter of D2<D1, wherein first liner ring of dielectric material is subsequently dried in air and sintered in air to greater than 500 C, but less than 1000 C;
- a first liner ring of conductive material deposited on the interior wall of the dielectric material, wherein the first liner ring of conductive material is subsequently dried in air and sintered in air to greater than 500 C, but less than 1000 C;
- a second liner ring of dielectric material coaxially adjacent the inner wall of the thru-via and having an inner diameter of D3<D2;
- wherein the second liner ring of dielectric material is dried in air and sintered in air to greater than 500 C, but less than 1000 C;
- and
- conductive material filling a remaining unfilled interior of the first thru-via, wherein the conductive material is dried in air and sintered in air to greater than 500 C, but less than 1000 C.
4 more elements
A method of fabricating coaxial thru-vias in a monolithic substrate, comprising:
- forming a first thru-via in the monolithic substrate having and interior diameter of D1;
- conformal depositing a layer L1 comprising a liner ring of conductive material on the interior wall of the thru-via such that the liner ring of conductive material has an interior of D2<D1;
- first air drying and then sintering the liner ring of conductive material;
- conformal depositing a layer L2 comprising a liner ring of insulating material on the interior wall of the thru-via such that the liner ring of insulating material has an interior diameter of D2<D3;
- first air drying and then sintering the liner ring of insulating material;
- filling the remaining unfilled portion of the thru-via with a conductive material;
- and
- first air drying and then sintering the conductive material.
5 more elements
Dependencies are inferred from the claim text.