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US 2022/0071002 A1Published application
Wired circuit board
AssigneeNitto Denko Corporation
InventorsMasami INOUE, Hiroshi YAMAZAKI
Life of this patent
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Abstract
A wired circuit board includes a base insulating layer, and a circuit disposed on a one-side surface in the thickness direction of the base insulating layer. The circuit includes a transmitting and receiving circuit and a component mounting circuit. The transmitting and receiving circuit includes a first wire. The first wire includes a first aspect ratio R1. The component mounting circuit includes a second wire electrically connected to the first wire. The second wire has a second aspect ratio R2 lower than the first aspect ratio R1.
Claims4
A wired circuit board comprising:
- an insulating layer, and
- a circuit disposed on a one-side surface in a thickness direction of the insulating layer,
- wherein the circuit includes
- a transmitting and receiving circuit, and
- a component mounting circuit electrically connected to the transmitting and receiving circuit,
- the transmitting and receiving circuit includes a first wire,
- the first wire has a first aspect ratio that is a ratio of a thickness to a width,
- the component mounting circuit includes a second wire electrically connected to the first wire, and
- the second wire has a second aspect ratio lower than the first aspect ratio.
6 more elements
Dependencies are inferred from the claim text.