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US 2022/0071000 A1Published application
Circuit board structure and manufacturing method thereof
AssigneeUnimicron Technology Corp.
InventorsTzyy-Jang Tseng, Shao-Chien Lee, John Hon-Shing Lau, Chen-Hua Cheng, Ra-Min Tain
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Abstract
The disclosure provides a circuit board structure including at least two sub-circuit boards and at least one connector. Each of the sub-circuit boards includes a plurality of carrier units. The connector is connected between the sub-circuit boards, and a plurality of stress-relaxation gaps are defined between the sub-circuit boards.
Claims10
A circuit board structure, comprising:
- at least two sub-circuit boards, each of the at least two sub-circuit boards comprising a plurality of carrier units;
- and
- at least one connector, connected between the at least two sub-circuit boards, wherein a plurality of stress-relaxation gaps are defined between the at least two sub-circuit boards.
A manufacturing method of a circuit board structure, comprising:
- providing a circuit substrate, and forming a plurality of carrier units on the circuit substrate;
- and
- forming a plurality of stress-relaxation gaps on the circuit substrate, dividing the circuit substrate into at least two sub-circuit boards and at least one connector, wherein the at least one connector is connected between the at least two sub-circuit boards, and the at least two sub-circuit boards comprise the carrier units.
Dependencies are inferred from the claim text.