Data link layer device and packet encapsulation method thereof
AssigneeShanghai Zhaoxin Semiconductor Co., Ltd.
InventorsRanyue Li, Jie Jin, Junping Li
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AssigneeShanghai Zhaoxin Semiconductor Co., Ltd.
InventorsRanyue Li, Jie Jin, Junping Li
Estimating the term…
A data link layer device and a packet encapsulation method are provided. The data link layer device includes a first and a second first-in-first-out (FIFO) module. The first FIFO module receives and stores multiple first data from an upper-layer module, and removes data gaps from the first data to store the first data in a continuous form. When the first FIFO module is not empty, the first FIFO module generates data of different lengths based on the current amount of data stored temporarily in the first FIFO module and a preset data length. When the data queue of the second FIFO module has enough space to receive the first data, the first FIFO module transfers the first data to the second FIFO module, and the first FIFO module transfers a header including the data length to a header queue of the second FIFO module.
A data link layer device, comprising:
A packet encapsulation method for a data link layer device, comprising:
Dependencies are inferred from the claim text.